Application:with paltform for battery packs

High power dynatron/FET/SCR, Power module, IGBT, High power Fast recovery diode, Schottky transistor, Lead attachment, wire bonding, TO-3¡¢TO-3P¡¢TO-3PF¡¢TO-3PN¡¢TO-3PL¡¢TO-220F¡¢TO-126¡¢TO-12F¡¢TO-66¡¢TO-251¡¢TO-202 etc.

Specification

1,electric requiement£º220VAC±10£¥¡¢50HZ¡¢be sure connected to ground

2,aluminium wire diameter£º75¡«500μm (3¡«20mil)

3,ultrasonic power£º0£­30W, two channel.can be set separately of the two point

4,bond time£º10£­500ms£¬two channel

5,bond force:30£­1200g£¬two channel

6,motorized Y£º0£­18mm

7,microscope rate£º7.5 and 15

8,working area£ºΦ25mm

9,light£ºadjustable brightness

10,size£º620×610×560mm

11,weight£º~40kg